
Fully automatic bga rework machine
1.Split vision for chip-level aligning
2.Automatic chip-feeder for feeding and receiving
3.Hot-air and IR working together
4.Laser posioning
Beskrivelse
Fully automatic bga rework station
A fully automatic BGA rework station is a tool used to repair or replace ball grid array (BGA) and other chip-level
components on a printed circuit board. The station is designed to automatically control the heating, cooling, and
alignment of the BGA component, making it easier to remove and install with precision and efficiency. The station
typically uses hot air or infrared heating to reflow the solder and align the BGA component to the correct position.
The automatic feature allows for precise temperature and duration control, which can minimize the risk of damage
to the PCB or the BGA component.


Model: DH-A2E
1.Product Features of Fully automatic bga rework station
•High successful rate of chip-level repairing. Desoldering, mounting and soldering process is automatic.
• Convenient alignment.
•Three independent temperature heatings + PID self-setting adjusted, temperature accuracy will be on ±1°C
•Built-in vacuum pump, pick up and place BGA chips.
•Automatic cooling functions.
2.Specification of Fully automatic bga rework station
3.Details of Fully automatic bga rework station



4.Why Choose Our laser position Fully automatic bga rework station?


5.Certificate of Optical alignment Fully automatic bga rework station

6. Packing list of Optics align Fully automatic bga rework station

7. Shipment of Fully automatic bga rework station
We ship the machine via DHL/TNT/UPS/FEDEX, which is fast and safe. If you prefer other terms of shipment, please feel free to tell us.
8. Contact us for an instant reply and the best price.
Email: alice@dinghua-bga.com
MOB/WhatsApp/Wechat: +8615768114827
Click the link to add my WhatsApp:
https://api.whatsapp.com/send?phone=8615768114827
Working video of fully automatic BGA rework station:
9.Related news about Fully automatic bga rework station
Shanghai IC Industry Investment Fund Increases Capital Tower Semiconductor
Recently, the signing ceremony of the capital increase agreement of Shanghai IC Capital Investment Fund Co., Ltd.,
Huada Semiconductor Co., Ltd. and Shanghai Jita Semiconductor Co., Ltd., affiliated to Shanghai Science & Technol-
ogy Investment Group, was held in the Chita Semiconductor Lingang Plant. Responsible comrades from Shanghai E-
conomic and Information Committee, City Lingang Management Committee, Shanghai Branch Venture Capital Gro-
up, Shanghai IC Industry Investment Fund, Huada Semiconductor, and Jita Semiconductor attended the ceremony.
Shanghai Jita Semiconductor's characteristic process production line project is a major project of the city with a total
investment of 35.9 billion yuan. It is an important part of the cooperation agreement between Shanghai Municipal G-
overnment and China Electronic Information Industry Group, and it is also the first major industrial project to be laun-
ched. The project is located in the Lingang Equipment Industrial Zone, Pudong New Area, Shanghai. It covers an area
of 230,000 square meters and was started in August last year. Currently, the main project is basically completed.
Shanghai actively cooperates with the national strategy, accelerates the creation of an integrated circuit industrial syst-
em with the most complete domestic industrial chain, the highest level of technology and the most competitive advant-
ages, and carries out the industrial layout of “one body and two wings”. Since its inception, Shanghai IC Industry Invest-
ment Fund has actively and pragmatically invested in major industrial projects in Shanghai, giving full play to the financ-
ial support for the real economy. This time, together with Huada Semiconductor, it has completed the capital increase f-
or JT Semiconductor. An iconic node of the project is a powerful impetus to the overall layout of the integrated circuit i-
ndustry in Shanghai.
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